Thermal Expansion
Less thermal expansion.
Less thermal expansion means less overall part expansion. This means fewer expansion joints are required in rain drainage systems, and there is less potential for solder joint failure due to expansion and contraction of soldered roofing and other components. Does this mean CopperPlus will last longer than mere copper? No. But it does mean there’s a lot less potential for failed solder joints.
The coefficient of thermal expansion of CopperPlus is significantly less than that of ordinary copper. If we’re talking about soldered panels on aging roofs, this could make the difference between a dry floor and a wet floor.
| Material | Temper | CTE, Linear 68-212ºF [µin/in·ºF] |
| CopperPlus | Annealed | 6.1 |
| UNS C11000 | O60 (soft) | 9.4 |
| UNS C11000 | H00 (1/8 hard) | |
| UNS C11000 | H01 (1/4 hard) | |
| UNS C11000 | H02 (1/2 hard) | |
| UNS C11000 | H04 (hard) | |
| UNS C12200 | O60 (soft) | 9.4 |
| UNS C12200 | H00 (1/8 hard) | |
| UNS C12200 | H01 (1/4 hard) | |
| UNS C12200 | H02 (1/2 hard) | |
| UNS C12200 | H04 (hard) |
Thermal properties for CopperPlus
and some typical copper alloys that are used
as copper architectural
strip which conform to ASTM B370.
Copper data from Copper Development Association database (www.copper.org).